50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation

Product Details
Customization: Available
Application: Automotive Manufacturing, Electronic device
Color: Amber
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  • 50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation
  • 50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation
  • 50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation
  • 50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation
  • 50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation
  • 50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation
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  • Overview
  • Product Description
  • Product Parameters
  • Detailed Photos
  • Application
  • Our Advantages
  • Certifications
  • Company Profile
  • Packing
Overview

Basic Info.

Model NO.
Pi Film
Material
Pi
Maximum Voltage
<10KV
Thermal Rating
H 180
Thickness
0.5 mm
UV Protection
No
Hardness
Soft
Width
Custom Size Accepted
Advantage
Environmentally Friendly
Base Thickness
12-250μm
Delivery
15-30days
Transport Package
Wooden Box/Pallet
Specification
Customized
Origin
Hangzhou
Production Capacity
600 Tons/Month

Product Description

Product Description
PI film (polyimide film) is a high-performance polymer film that is widely used in many high-tech fields. Weshare's PI membrane has the following characteristics:
(1) Appearance
It is amber translucent, the surface is extremely smooth, there are no obvious impurities, pinholes, bubbles, and the edges are neat. This appearance quality ensures reliability in high-precision application scenarios, such as in electronic display manufacturing, and the display effect will not be affected by defects on the film surface.
(2) Various thickness specifications
Provides a variety of thickness options from 25μm to 125μm (including 25μm, 40μm, 50μm, 75μm, 100μm, 125μm), which can meet the specific needs of PI film thickness in different industries and different products. Whether it's flexible electronic circuits that require less thickness, or industrial insulation applications that require thicker PI films for strength, we have the right product.

It has excellent high and low temperature resistance, electrical insulation, adhesion, radiation resistance, and medium resistance, and can be used for a long time in a temperature range as low as -269°C and as high as +400°C. The composite film also has the characteristics of high-temperature self-adhesive sealing. They can be used as high-temperature-resistant flexible printed circuit substrates, flat circuits, wires and cables, insulation layers of electromagnetic wires, and as insulation for various motors. At present, it has been widely used in industrial sectors such as aircraft, spacecraft, nuclear industry, nuclear submarines, electric locomotives, audio devices, instrument communications, petrochemical industry, etc.

Weshare customized services
1/We know that different customers have different special needs for PI membranes, so we provide highly customized services. Whether it's a special thickness, specific performance parameters, or special packaging and delivery requirements, we are able to customize production to meet our customers' specific needs.
2/Establish close cooperative relationships with customers, intervene from the product research and development stage, provide customers with professional technical consultation and solutions, help customers optimize product design, reduce costs, and improve product competitiveness.
Product Parameters
Target Name Index Value Model H Film HF Film FHF Fil)
Appearance
Transparent brown film with smooth surface and regular edges. No pinhole and impurity
Unit same to the left same to the left same to the left
Specification
thickness
mm 0.02-0.03(±0.003) 0.031-0.04(±0.004) 0.041-0.20(±0.005) 0.03-0.12(±0.005)
Specification
width
mm 6-1000 (same to the left) (same to the left) (same to the left)
Specification
length
mm ≥65 ≥50 ≥70 ≥50
Tensile Strength Mpa(kgf/cm²) ≥135(≥1350) ≥135(≥1350) ≥145(≥1450) ≥90(≥900)
Elongation % ≥60 ≥60 ≥65 ≥40
Peel Strength N/2.5cm(gf/2.5cm)     ≥6(≥600) ≥6(≥600)
Breakdown Strength MV/m ≥180 ≥180 ≥160 ≥120
Insulation Resistance 200ºC/Ω ≥10¹³ ≥10¹³ ≥10¹³ ≥10¹³
Volume Resistivity 200ºC/Ω·m ≥10¹0 ≥10¹0 ≥10¹0 ≥10¹0
(Dielectric Constant (48-62HZ))   3-4 3-4 2-3 2-3
(Dissipation Factor tan (48-62HZ))   10³- 10³- 10³- 10³-

Storage Condition :23 0C ,65%RH/,Use Temperature  15~28oC .
50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation

Detailed Photos
50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation
50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation
50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation
50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation
50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation
Application

50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation

Our Advantages

50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation
Certifications

 

50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation
Company Profile

50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation

Packing
50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation
50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation

50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation50 Micron Amber Color Polyimide Pi Film with Heat Resistant Feature for PCB Insulation

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